Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g Jar SMD291SNL250T3
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Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g JarProduct Description
Solder Paste in jar 250g (T3) SAC305 no clean 88.5% metal.
Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g Jar Specifications
|
Alloy |
Sn96.5/Ag3.0/Cu0.5 |
|
Flux Type |
Synthetic No-Clean |
|
Flux Classification |
REL0 |
|
Metal Content |
88.5% metal by weight |
|
Particle Size |
T3 (25-45 microns) |
|
Melting Point |
217-220C (423-428F) |
|
Size |
250g Jar |
Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g JarStencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g JarStencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g JarStorage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g Jar Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Chip Quik No Clean Lead-Free Solder Paste Literature Downloads
Safety Data Sheet (SDS)
Technical Data Sheet (TDS)