Chip Quik Sn63/Pb37 No Clean Solder Paste (T3) 250g Jar SMD291AX250T3
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Chip Quik Sn63/Pb37 No Clean Solder Paste (T3) 250g Jar Description
ChipQuik Sn63/Pb37 No Clean Solder Pastein a250gjar (T3) 90.25% metal.
Chip Quik Sn63/Pb37 No Clean Solder Paste (T3) 250g Jar Specifications
|
Alloy |
Sn63/Pb37 |
|
Flux Type |
Synthetic No-Clean |
|
Flux Classification |
REL0 |
|
Metal Content |
90.25% metal by weight. |
|
Particle Size |
T3 (25-45 microns) |
|
Melting Point |
183C (361F) |
|
Size |
250g Jar |
Chip Quik Sn63/Pb37 No Clean Solder Paste (T3) 250g Jar
Chip Quik Sn63/Pb37 No Clean Solder Paste (T3) 250g JarStencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Chip Quik Sn63/Pb37 No Clean Solder Paste (T3) 250g JarStencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA)
Chip Quik Sn63/Pb37 No Clean Solder Paste (T3) 250g JarStorage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Chip Quik Sn63/Pb37 No Clean Solder Paste (T3) 250g Jar Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Chip Quik Sn63/Pb37 No Clean Solder Paste (T3) 250g JarLiterature
Safety Data Sheet (SDS)
Technical Data Sheet (TDS)