Desco Tape Wescorp Esd Polyimide Hi Temp 6mm X 32.9 M 81270
MPN: 81270
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RPI: 2156776
Trackable Shipping
Australia Wide
Handling Time
7-10 Business Days Handling Time
(Prior to Dispatch)
(Prior to Dispatch)
Return Policy
No Return (Unless Manufacturer Defect)
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Click & Collect (no postage cost)
Unit 1/25 Bearing Road, Seven Hills, NSW, 2147
Ready-to-pickup: 7-10 Business Days*
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Desco Tape Wescorp Esd Polyimide Hi Temp 6 MM X 32.9 M Overview
Removal leaves little or no residue
Masking off PCBs for IR reflow ovens or wave soldering under 572F (300C) ~ 10 seconds
Near zero voltage generation when tape removed from PCB (at 50% relative humidity)
Near zero voltage generation when tape unrolled from roll (at 50% relative humidity)
Low-sloughing plastic core
Ideal for masking gold leads and other components on boards populated with sensitive integrated circuits
For best results apply to board using a rubber roller
Desco Tape Wescorp Esd Polyimide Hi Temp 6 MM X 32.9 MFeatures
- Adhesive surface resisitivity
- 10E3 to 10E4 Ohms
- Max Temperature
- 572F (300C) 10 seconds
- Adhesive Strength
- 1 N/cm (DIN), 5 oz/in2 (ASTM)
- 1.0 mil thick (0.0254mm) Polyimide Film (DuPont Kapton or equivalent)
- Conductive Polysiloxide Adhesive
- Total Thickness
- 0.060 mm (DIN), 2.4 mil (ASTM)
- Color
- Brown opaque
- Adhesive Type
- Silicone
- Tensile Strength
- 50 N/cm (DIN), 28 lbs/in2 (ASTM)
- Elongation
- 70% (DIN & ASTM)
- Lead-free RoHS compliant
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