MG Chemicals Medium Cure Thermally Conductive Adhesive, 200ml 8329TCM-200ML
MPN: 8329TCM-200ML
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RPI: 2171745
Trackable Shipping
Australia Wide
Handling Time
7-10 Business Days Handling Time
(Prior to Dispatch)
(Prior to Dispatch)
Return Policy
No Return (Unless Manufacturer Defect)
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MG Chemicals Medium Cure Thermally Conductive Adhesive, 200ml
MG Chemicals Medium Cure Thermally Conductive Adhesive, 200ml
Overview
8329TCM is a thermally conductive two-part epoxy adhesive. It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates.
This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies.
8329TCM has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFM. For a faster working life, use 8329TCF. For a longer working life, use 8329TCS.
Feature
- Thermal conductivity of 1.4 W/(mK)
- 1:1 mix ratio
- Working life: 45 minutes
- Cure time: 24 hours room temperature or 1 hour at 65 C (149 F)
- Provides strong electrical insulation
- High tensile and compressive strength
- Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
- Shelf life: 3 years
- RoHS 3 compliant
Specifications
Catalog Number: 8329TCM-200ML
Size: 494g (1.09 lb)
Packaging: 2 Can kit
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