MG Chemicals SAC305 Lead Free No Clean Solder Paste, 25g 4900P-25G
(Prior to Dispatch)
Type in your postcode or suburb to get an estimate on postage cost.
MG Chemicals SAC305 Lead Free No Clean Solder Paste, 25g
MG Chemicals SAC305 Lead Free No Clean Solder Paste, 25g
Overview
The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux. This lead-free and halogen-free solder paste is designed for extreme flux activity and enhanced printing characteristics needed for ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.
Applications and Usages
The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when using an ultra-fine pitch stencils down to 0.3 mm.
Features and Benefits
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Repeatable and consistent print characteristics
- Long stencil and tack life to accommodate high speed printing
- Excellent wettability
- Suitable for air or nitrogen atmosphere
- Medium soft, non-cracking residues
- Dobb-Frank (DRC conflict free)
- REACH (compliant)
- RoHS (compliant)
Specifications
- Catalog Number: 4900P-25G
- Size: 25g (0.88 oz)
- Description: Syringe