MG Chemicals Thermal Adhesive 25ml 8349TFM-25ML

MG Chemicals Thermal Adhesive 25ml

This thermal adhesive is a 2-part 1-1 epoxy system. It is a smooth, dark, off-grey paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. It meets UL 94V-0 Standard as flame retardant. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.

This thermal adhesive is most often used to bond heatsinks to CPUs, LEDs, and other electronic components, but is also suitable in many other applications that require a thermally conductive electrically insulating adhesive.

This product is viscous, yet flowable enough to dispense from a syringe. The 50ml size may be used with a mixing tip when dispensed with a caulking gun or pressurized system.

This thermal glue has a 20-minute working time. We also offer a faster-setting alternative with a 5-minute working time (8329TFF), a heat cure alternative with a 4-hour working time (8329TFS), and a heat cure 1-part alternative with an unlimited working time (9460TC). A silver-filled electrically conductive version and thermal pastes are also available.

• Thermal conductivity of 0.9 W/(m K)

• Flame retardant-meets UL 94V-0

• 1:1 mix ratio

• High dimensional stability

• Working life: 20 minutes

• Cure time: 16 hours at room temperature or 20 minutes at 65 C (149 F)

• Provides strong electrical insulation

• High compressive and tensile strength

• Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons

• Resistivity 6.5 x 1012 cm

• Hardness 92 D

• Tensile Strength 25 N/mm2

• Compressive Strength 115 N/mm2 L

• ap Shear (stainless steel) 6.7 N/mm2, (Aluminum) 4.4 N/mm2

• Glass Transition Temperature (Tg) 80 C

• CTE Prior Tg 20 ppm/C

• CTE After Tg 120 ppm/C

• Thermal conductivity @ 25 C [W/(m K)] 0.9.

• Service temperature range [C] -65 to 120.

• Max. Intermittent Temperature 200C

• Net Volume: 25ml

• Net Weight: 44.6g

• Packaging: 2 Syringe Kit

Technical Data Sheet