Soder-Wick No Clean Desolder Braid 0.8mm-5ft () 60-1-5
MPN: 60-1-5
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RPI: 2174061
$18.98
Trackable Shipping
Australia Wide
Handling Time
7-10 Business Days Handling Time
(Prior to Dispatch)
(Prior to Dispatch)
Return Policy
No Return (Unless Manufacturer Defect)
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Click & Collect (no postage cost)
Unit 1/25 Bearing Road, Seven Hills, NSW, 2147
Ready-to-pickup: 7-10 Business Days*
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Soder-Wick No Clean Desolder Braid 0.8mm-5ft ()
Soder-Wick No Clean Desolder Braid 0.8mm-5ft (60-1-5)
Overview
Soder-WickNo Clean Desolder Braid is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-WickNo Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-WickNo Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.
Features and Benefits
- Soder-Wick No Clean packaged in ESD-safe static dissipative bobbins
- Minimizes the risk of damage associated with static electricity
- Patented noncorrosive, halide free, organic no-clean flux
- Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
- Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance
- Soder-Wick No Clean SD safely removes solder in all applications requiring Type ROL0 flux
- BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes
Specifications
- MIL-F-14256 F
- NASA-STD-8739.3 Soldered Electrical Connections
- DOD-STD-883E, Method 2022
- ANSI/IPC J STD-004, Type ROL0
- Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
- Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderabilit
- #1 white, 0.030"/0.8mm width,5' / 1.5 m length on SD bobbin
Resources
(Please click title to download)
Safety Data Sheet
Technical Data Sheet
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